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01 · INSIDE SLLPCB
Our PCB Manufacturing Factory
From engineering review to PCB fabrication and assembly, our teams connect the processes behind your next board. Explore our equipment, manufacturing capabilities and production floor.
Engineering and production. Connected.
Our operations bring together overseas business, supply chain management, electronic design, prototype verification and assembly. Manufacturing and technical teams support CAM, process engineering, quality assurance and testing.
Songgang, Shenzhen
Overseas business and supply chain management.
Guilin
Schematic design, PCB layout and pilot sample verification.
Xixiang, Shenzhen
PCB assembly and finished product assembly.
02 · THE PRODUCTION TOOLS
PCB Manufacturing Equipment
Drilling, imaging, plating, lamination and optical inspection connect each stage of PCB production.
Precision drilling
Mechanical drilling for through-holes and multilayer interconnections.
Laser Direct Imaging
Digital imaging transfers circuit patterns onto photoresist.
Vertical Continuous Plating
VCP equipment for copper deposition and through-hole metallization.
Automated Optical Inspection
AOI compares circuit patterns to identify opens, shorts and pattern defects.
Vacuum lamination
Controlled heat, pressure and vacuum bond the multilayer stack.
03 · TECHNICAL CAPABILITIES
PCB Manufacturing Capabilities
Manufacturing capabilities for rigid, flexible and rigid-flex PCBs, from fine-line circuits to high-layer-count constructions.
Swipe horizontally to view manufacturing capabilities →
|
Manufacturing parameter |
Manufacturing capability |
|---|---|
|
Maximum rigid PCB layers |
68 |
|
Maximum flexible PCB layers |
20 |
|
Maximum rigid-flex PCB layers |
24 |
|
Minimum trace / space |
50 / 50 µm |
|
Copper weight |
1/7–12 oz |
|
Rigid PCB thickness |
0.1–14 mm |
|
Flexible PCB thickness |
0.06–1.0 mm |
|
Processing width |
3–900 mm |
|
Processing length |
3–2100 mm |
|
Minimum mechanical hole |
150 µm |
|
Minimum laser hole |
100 µm |
|
HDI build-up |
9 + N + 9 |
|
Minimum solder-mask bridge |
60 µm |
|
Impedance tolerance |
±5% |
Share your stackup, fabrication drawing, copper requirements and quantities.
04 · PROCESS CONTROL
Quality Control & Inspection
Quality checks follow the board through engineering, materials, fabrication and shipment.
Engineering review
Review the fabrication files, materials, stackup and customer specifications. Convert approved design data into controlled manufacturing instructions.
Incoming material inspection
Check substrates, copper foil and other incoming materials against purchasing and production requirements.
In-process inspection
Monitor critical production stages and inspect circuit patterns with AOI. Verify lamination, drilling and plating against manufacturing instructions.
Electrical & final inspection
Test circuits for opens and shorts. Check finished boards for visual, dimensional and workmanship requirements.
Shipment release
Verify part numbers, quantities, labels and packaging. Release inspected batches after the final quality check.
05 · A CLOSER LOOK
Our Factory Photos
See our factory, equipment and production teams. Select a photograph for a closer view.
ON THE PRODUCTION FLOOR
See the factory in motion.
Watch our factory video for a closer look at the manufacturing environment and production equipment.
Let’s review your next PCB.
Send your design files and project requirements to our engineering team.
