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Custom PCB prototyping

PCB Prototyping Services for Complex Designs

From standard multilayer boards to advanced HDI, flexible, and rigid-flex PCBs, SLLPCB supports custom PCB prototyping with engineering review, manufacturing solutions, and quality inspection. Whether you’re validating a new design or preparing for production, we’re here to help bring your PCB project to life.

  • Advanced PCB Manufacturing
  • Engineering & DFM Support
  • Prototype to Production

Upload your Gerber and drill files to get a tailored PCB prototype quotation.

Rigid-flex PCB sample with green rigid sections and amber flexible interconnect

Advanced structures. Practical engineering support.

Integrated rigid sections and flexible interconnects for compact, three-dimensional electronic assemblies.

Engineering comes first

Why Choose SLLPCB?

Support for the decisions that matter before fabrication, during validation and as your project moves into production.

Advanced Manufacturing Capabilities

Manufacture multilayer, HDI, flexible, rigid-flex and high-frequency PCB prototypes with fine-line routing, advanced via structures and a wide choice of laminates.

Engineering & DFM Support

Get practical support with stackup design, drill structures, trace spacing and controlled impedance. DFM feedback helps resolve fabrication issues before production.

Consistent Quality Control

Support design validation with AOI, electrical testing, impedance measurement and final inspection. Clear fabrication data and inspection records help your team evaluate each build.

Prototype-to-Production Support

Move from engineering samples to pilot builds and volume production with continued fabrication, assembly and component sourcing support.

Manufacturing capabilities

PCB Prototyping Capabilities

SLLPCB PCB prototyping manufacturing capabilities
CapabilitySLLPCB Manufacturing Capabilities
Layer CountRigid: up to 68; flexible: up to 20; rigid-flex: up to 24 layers
PCB TypesRigid, multilayer, HDI, flexible, rigid-flex, high-frequency and heavy copper PCBs
MaterialsFR-4, high-Tg FR-4, polyimide, selected Rogers laminates, low-loss materials and hybrid stackups
PCB ThicknessRigid: 0.1–14 mm; flexible: 0.06–1.0 mm
Finished Copper Thickness1/7–12 oz
Minimum Trace / Space50 / 50 µm
Minimum mechanical hole0.15 mm
Blind / Buried ViasMechanical blind and buried vias; blind-hole diameters of 0.15–0.7 mm
Microvias / HDIMinimum laser hole: 0.10 mm; HDI build-up to 9 + N + 9; any-layer HDI
Controlled Impedance±5%
Surface FinishesHASL, lead-free HASL, ENIG, ENEPIG, OSP, immersion silver, immersion tin and gold options

Choose your board technology

PCB Prototype Types

Standard and advanced PCB constructions for your next prototype.

Rigid PCB panel with red solder mask and exposed contact pads

Standard PCB Prototypes

Materials: FR-4, High-Tg FR-4
Applications: Control boards, sensors, embedded systems.

Green multilayer PCB panel with fine routing and component pad areas

Multilayer PCB Prototypes

Features: Multilayer stackups, controlled impedance
Applications: High-speed digital and mixed-signal designs.

Blue HDI PCB panel with dense routing and fine-pitch pad patterns

HDI PCB Prototypes

Processes: Microvias, via-in-pad, blind/buried vias
Applications: Fine-pitch BGA and compact electronics.

Amber branched flexible printed circuit sample with contact pads

Flexible PCB Prototypes

Material: Polyimide (PI)
Features: Thin interconnects, coverlay, local stiffeners.

Rigid-flex PCB sample with green rigid sections and amber flexible interconnect

Rigid-Flex PCB Prototypes

Materials: FR-4 + polyimide
Features: Integrated rigid/flex sections, 3D assembly.

High-frequency PCB product sample with green circuitry and exposed gold-colored areas

High-Frequency PCB Prototypes

Materials: Rogers, low-loss laminates
Applications: RF, microwave and wireless designs.

Working with high-current designs? Explore heavy copper PCB manufacturing. For signal-integrity planning, see our high-speed PCB design guidelines.

Specify the right combination

Materials & Surface Finishes

Material choice and surface finish should work together with the PCB structure, assembly process and end-use requirements.

Materials

  • FR-4 — Versatile glass-reinforced epoxy laminates for standard rigid and multilayer prototypes.
  • High-Tg FR-4 — Thermally robust laminate options for multilayer stackups, repeated assembly heat exposure and demanding operating conditions.
  • Rogers — RF and high-frequency materials including RO3003, RO4350B and RO4835.
  • Polyimide — Flexible circuit substrates and coverlay, plus VT-901 polyimide laminate for rigid-board applications.
  • Specialized Laminates — Low-loss materials such as Megtron 7 and I-Tera MT40, and hybrid constructions combining RF and FR-4 layers.

Surface Finishes

  • HASL / Lead-Free HASL — Solder-coated pads for conventional assembly and general-purpose circuit boards.
  • ENIG — A flat nickel/gold finish for fine-pitch pads and mixed component layouts.
  • ENEPIG — Nickel/palladium/gold finish for designs combining soldering and wire-bonding requirements.
  • OSP — An organic protective coating that preserves copper-pad solderability.
  • Additional Finishes — Immersion silver, immersion tin, hard gold and gold-finger plating for different assembly and contact requirements.

Advanced PCB construction

PCB Prototype Samples

HDI, flexible and rigid-flex PCB prototypes.

Blue HDI PCB panel with dense routing and fine-pitch pad patterns

HDI PCB Sample

Type: HDI PCB
Layer count: 2–68 layers
Material: High-Tg FR-4, low-loss laminates
Process details: Laser microvias, blind/buried vias, copper filling, via-in-pad

Amber branched flexible printed circuit sample with contact pads

Flexible PCB Sample

Type: Flexible PCB
Layer count: 1–20 layers
Material: Polyimide (PI), RA / ED copper
Process details: Coverlay, PI / FR-4 stiffeners, fine-line routing, ENIG

Rigid-flex PCB sample with green rigid sections and amber flexible interconnect

Rigid-Flex PCB Sample

Type: Rigid-Flex PCB
Layer count: 14 layers
Material: FR-4 + polyimide (PI)
Process details: Multilayer lamination, plated through-holes, coverlay

Support at every stage

From Prototype to Production

Prototype → Engineering Validation → Design Optimization → Pilot Production → Volume Production

01

Prototype

Build boards to evaluate the design.

02

Engineering Validation

Check electrical and mechanical performance.

03

Design Optimization

Resolve design and manufacturability issues.

04

Pilot Production

Review readiness with a small production build.

05

Volume Production

Confirm specifications for the production order.

Keep your product moving with engineering and manufacturing support from the first prototype through pilot builds and volume production. Carry stackup information, design revisions and test requirements forward as the product matures, with PCB fabrication, assembly and component sourcing available throughout development.

Before moving to volume production, engineers should check the PCB manufacturing capabilities against the final stackup, copper weight, and drilling requirements.

Assembled green printed circuit board positioned in a test fixture

Beyond the bare board

PCB Assembly & Component Sourcing

Combine bare PCB fabrication, component procurement and assembly in one coordinated build. SLLPCB supports prototype PCBA with SMT and through-hole assembly, BOM sourcing, inspection and testing to help you evaluate a complete working board.

Send your BOM, placement data and assembly drawings together with the Gerber package to request a complete PCB and assembly quotation.

Engineering and inspection

Quality Assurance

Reliable prototypes start with sound fabrication data and well-controlled manufacturing. DFM, optical inspection and electrical checks help identify issues before the boards reach your engineering bench.

Operator reviewing a PCB with automated optical inspection equipment

DFM Review

Check stackup, drill data, trace spacing, annular rings, copper distribution and fabrication notes before manufacturing.

AOI Inspection

Inspect circuit patterns for shorts, opens, missing copper and other visible fabrication defects.

Electrical Testing

Check continuity and isolation to identify open circuits and unintended connections.

Impedance Testing

Measure controlled-impedance structures against the specified electrical targets.

Final Quality Inspection

Check appearance, dimensions, surface finish and finished-board workmanship before shipment.

Include your required IPC class, impedance targets and inspection reports in the fabrication specification. For design references, see the IPC design standards.

Before you send your files

PCB Prototyping FAQ

Practical answers for procurement teams, engineers and product development teams.

Send Gerber files and drill data. Include a fabrication drawing, layer stackup, material grade, copper weights, surface finish, quantity and any impedance or special-process requirements. For assembly, also provide the BOM, component placement data and assembly drawings.

Production lead times depend on the PCB layer count, materials, manufacturing processes, and order quantity. Standard rigid boards and complex designs such as HDI or rigid-flex PCBs may require different production schedules. Send us your Gerber files, and our team will review your requirements and provide an estimated lead time with the quotation.

SLLPCB supports low-volume prototype orders and small-batch builds for development and engineering validation. Include your required quantity in the RFQ so we can provide suitable fabrication and panelization options.

Yes. SLLPCB supports HDI prototypes with laser-drilled microvias, blind and buried vias, sequential build-up, copper via filling and via-in-pad structures. HDI constructions include 1+n+1 through 4+n+4, with any-layer HDI available for prototype projects.

Yes. Our prototype assembly services cover SMT and through-hole assembly, component sourcing, inspection and testing. Send your BOM, component placement data and assembly drawings together with the PCB fabrication files to request a complete build quotation.

Yes. SLLPCB supports the full development path from initial prototypes and engineering validation through design optimization, pilot builds and volume production. PCB manufacturing, assembly and component sourcing can be coordinated as your product moves through each stage.

Complete the quote form below and attach your design package, or email sales@sllpcb.com. Include quantity and technical requirements. The form accepts ZIP, RAR, 7Z and GBR files up to 20 MB; send larger packages by email or contact us to arrange file transfer.

Start with your design files

Request a PCB Prototype Quote

Upload your Gerber package and tell us the board size, layer count and quantity. Get a quotation covering PCB fabrication, optional assembly and an estimated production lead time.

    ZIP, RAR, 7Z or GBR · Maximum 20 MB. Include drill data, fabrication notes and stackup requirements where available. For larger packages or assembly BOMs, email sales@sllpcb.com.

    Prefer email? Send your Gerber package to sales@sllpcb.com. Need an engineering discussion first? Explore DFM support or contact our team.

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