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01
4–6 layers
General control boards
Standard FR-4 with signal and power-plane planning.
MULTILAYER PCB FABRICATION
Multilayer PCBBuilt around
your next design.
From control boards to complex backplanes. Bring your layer stackup, routing and material requirements into one coordinated manufacturing review.
4–68Layer-count reference
StackupMaterial & construction review
ImpedanceTargets & test requirements
Prototype to productionRequirements reviewed per build
01 · FIND YOUR CONSTRUCTION
The right layers.
The right starting point.
Compare the reference ranges below, then share your actual stackup for review. Layer count alone does not define a board’s manufacturing requirements.
02
8–12 layers
More routing. More control.
High-Tg FR-4 and selected low-loss constructions for more complex signal layouts.
03
14–68 layers
Complex multilayer builds
High-layer-count and backplane constructions, reviewed against the complete fabrication specification.
Manufacturing reference
Choose a layer group to explore the original capability values.
Reference limits are separate and may not apply together. Confirm copper, material, finished thickness, drilling process and acceptance criteria for your construction. Mechanical drilling and laser microvias are different processes; the mechanical hole minimum is 0.15 mm; the laser hole minimum is 0.10 mm.
Compare all three groups in the complete engineering matrix
|
Parameter |
BASIC (4–6 Layers) |
ADVANCED (8–12 Layers) |
HIGH-END / PRO (14–68 Layers) |
Complexity & Logic |
Typical Use Case |
|---|---|---|---|---|---|
|
Layer Count |
4 – 6 Layers |
8 – 12 Layers |
14 – 68 Layers (incl. backplane) |
↑ Layer Count / Stack-up |
Structural assessment for engineers |
|
Application Positioning |
General control boards |
High-speed signal + control hybrid |
Core logic / Backplanes / Server |
↑ System importance |
Project tiering & complexity |
|
Base Material |
Standard FR-4 |
High-Tg FR-4 / Partial low-loss |
High-Tg / Low-loss (Megtron/Rogers) |
↑ Performance requirements |
Signal integrity / thermal performance |
|
Typical Stack-up |
1–2 power planes + signal |
Multiple power + high-speed diff pairs |
Multi-plane + high-speed diff pairs |
↑ Finer stack-up planning |
Designer stack-up planning |
|
Surface Finish |
HASL / OSP |
ENIG / OSP |
ENIG / ENEPIG / Selective plating |
↑ HDI-friendly finishes |
BGA/QFN solder reliability |
|
Finished Board Thickness |
0.2 – 1.6 mm |
0.4 – 2.0 mm |
0.1 – 14 mm |
↑ Thickness & rigidity |
Connector engagement / stiffness |
|
Min. Trace / Space |
0.075 mm (3 mil) |
0.075 mm (3 mil) |
0.05 mm (50 µm) |
↑ Tighter routing density |
High-density routing |
|
Mechanical Drill Size |
0.15 mm |
0.15 mm |
0.15 mm |
↓ Drill size precision |
Via / connector compatibility |
|
Impedance Control |
Partial critical signals |
Full critical high-speed channels |
Full-board control incl. diff pairs |
↑ Controlled lines |
High-speed interface planning |
|
Supported Data Rates |
≤ 1–2 Gbps |
≤ 5–10 Gbps |
10 – 25+ Gbps (Differential) |
↑ Higher rate capability |
Protocol selection (PCIe / USB) |
|
Operating Temp Range |
0 to 85 °C |
-20 to 105 °C |
-40 to 125 °C (Automotive grade) |
↑ Environmental robustness |
Industrial / automotive deployment |
|
Reliability Standards |
IPC-6012 Class 2 |
Class 2 / Class 3 |
Class 3 / IATF 16949 Certified |
↑ Certification level |
Quality grade alignment |
|
Blind / Buried Vias |
None or minimal |
Single-direction buried vias |
Multi-stage blind/buried + local HDI |
↑ Via structure complexity |
Works with fine-pitch components |
|
Backdrilling |
Optional |
Standard for high-speed links |
Extensive backdrilling + stub removal |
↑ SI optimization needed |
Stub removal / eye-diagram optimization |
Have a stackup that falls outside these groups?
02 · STACKUP & ENGINEERING
Performance starts
between the layers.
A multilayer PCB combines copper circuits, cores and prepreg into one laminated structure. Plan the electrical connections and the physical construction together.
Balance the construction.
Review core and prepreg distribution, copper balance and finished thickness to manage lamination and warpage risks.
Define the signal environment.
Specify reference planes, single-ended and differential impedance targets, trace geometry and dielectric thickness.
Choose the connections.
Match through, blind, buried and microvia structures to the required layer connections and package escape routing.
8-LAYER CONCEPTILLUSTRATIVE ONLY
L1 · Signal
Prepreg
L2 · Ground
Core
L3 · Signal
Prepreg
L4 · Power
Core
L5 · Power
Prepreg
L6 · Signal
Core
L7 · Ground
Prepreg
L8 · Signal
Planning routing and layer connections?
03 · CONNECTIONS THAT FIT
More control.
Where it matters.
Select the process for the connection you need. Advanced features are reviewed for the proposed construction, rather than assumed for every multilayer board.
01
VIPPO
Filled and plated-over vias help create component land areas over via locations. Specify fill material, plating and surface requirements for review.
02
Blind & buried vias
Connect selected layers where the routing requires it. Buildup sequence, lamination stages and microvia geometry are reviewed with the stackup.
03
Backdrilling
Remove unused portions of through-hole barrels where specified to reduce via-stub effects in high-speed channels.
04
Controlled impedance
Define the target, tolerance, reference planes and coupon requirements. Agree on the measurement method and the records needed for the build.
04 · QUALITY & PROCESS
See the process.
Specify the evidence.
Inspection requirements belong in the fabrication specification. Agree on the applicable acceptance class, sampling and test documentation before the build.
01
Inner-layer inspection
Define the optical inspection and pre-lamination checks required for internal circuits.
02
Layer registration
Review alignment requirements and the verification method for the layer count and construction.
03
Microsection analysis
Specify the cross-section evidence needed for plating, interconnections and acceptance requirements.
04
Thermal & electrical verification
Agree on thermal stress, electrical test and impedance records where required by the order.
Need inspection records or a specific acceptance class?
05 · MATERIAL SELECTION
Start with the
right substrate.
Specify the material grade or the properties your design requires. Review dielectric performance, thermal reliability and lamination compatibility together.
Grades below are references from the existing material list. Availability, compliance requirements and suitability for a hybrid stackup are confirmed for the order.
01
High-Tg & halogen-free
Thermal and lamination requirements
Shengyi · ITEQ · Ventec
S1000-2M · IT-180A · IT-158 · VT-47
02
High-speed / low-loss
High-speed digital signal requirements
Panasonic · TUC · Isola
Megtron 6 · Megtron 7 · TU-872 SLK · 370HR
03
RF / microwave
High-frequency and hybrid constructions
Rogers · Taconic
RO4350B · RO4003C · RT/duroid 5880 · RF-35
04
Thermal & specialty
Thermal and special-construction requirements
Bergquist · Laird · Arlon
T-Clad · Arlon 85N · Heavy-copper prepreg
06 · BEFORE YOU SEND YOUR FILES
A few details.
A clearer quote.
Practical answers for engineering and purchasing teams.
What layer counts can I request?
The existing manufacturing reference covers 4–6, 8–12 and 14–68 layer constructions, including backplane options. Send the complete stackup and fabrication requirements so the proposed layer count, thickness and interconnections can be reviewed together.
Can you review a hybrid stackup such as Rogers + FR-4?
Yes. Include the exact material grades, dielectric thicknesses, copper weights and layer arrangement. Thermal and lamination compatibility, impedance targets and material availability must be reviewed for the proposed construction.
How should I specify controlled impedance?
State the single-ended and differential targets, tolerance, controlled layers, reference planes and test requirements. The existing page lists ±5% to ±8% reference tolerances; the applicable tolerance, geometry, coupon and report requirements must be agreed for the actual build.
What affects the production lead time?
Layer count, materials, lamination stages, via processing, quantity and inspection scope all affect the schedule. The previous page lists 5–7 days for selected 4–8-layer prototypes and 12–20 days for complex 14+ layer boards. These are reference ranges; request an order-specific fabrication schedule and allow separately for shipping.
Which files do I need for a multilayer PCB quote?
Send Gerber and drill data, the layer stackup, fabrication drawing, board dimensions and quantity. Include copper weights, material, surface finish, impedance requirements, acceptance criteria and target delivery date. Add BOM and component placement data when assembly is required.
Can the prototype construction be used for production?
Use the approved prototype construction as the starting point for the production review. Changes to materials, stackup, via geometry, quantity or test requirements may require another engineering review before the next order.
YOUR NEXT MULTILAYER BUILD
Let’s build
the next layer.
Share your design files and project requirements. Start with what you have; flag the stackup decisions that still need review.
Include with your RFQ
Assembly required? Add the BOM and placement data.
