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Fabrication technologies & specifications
PCB Manufacturing
Capabilities.
Board structures, materials and process capabilities for multilayer, HDI, high-frequency, heavy copper and rigid-flex PCB manufacturing.
01 / Board technologies
The construction
sets the process.
Explore our multilayer, HDI, high-frequency, flex, rigid-flex and heavy copper manufacturing capabilities.
Multilayer fabrication.
From conventional rigid boards to high-layer-count constructions. Define the stackup, material system, copper requirements and finished geometry together.
HDI & via-in-pad.
Microvias, blind and buried vias, sequential build-up and filled, plated-over connections for dense interconnect structures.
RF & high-speed constructions.
Low-loss laminates, controlled-impedance structures and via transitions for RF and high-speed designs.
Flex & rigid-flex fabrication.
Polyimide-based flexible circuits and rigid-flex constructions. Define the flexible region, rigid transitions and installation requirements in the fabrication data.
Heavy copper fabrication.
Heavy copper fabrication for high-current and power designs, with copper etching, plating and multilayer construction.
02 / Materials & stackup
Built layer by layer.
Specified as a system.
FR-4, high-Tg, high-frequency and polyimide materials for multilayer, RF and flexible circuit constructions.
03 / Process capability
Small details.
Defined manufacturing controls.
Hole geometry, via treatment, surface finish and lamination are part of the build specification.
Holes. Vias. Interconnects.
CNC drilling, blind and buried vias, microvias and VIPPO are different process choices. Specify each connection and its finished condition.
Copper & surface finish.
Review base and finished copper, plated-hole copper and the exposed surface-finish area. Match the finish to soldering, contact and assembly requirements.
Lamination & dimensional control
The stackup becomes
a finished board.
Vacuum lamination brings copper, core and prepreg together into multilayer boards with controlled thickness and finished dimensions.
04 / Technical specifications
Find the manufacturing
detail you need.
Search manufacturing specifications by parameter or process category.
|
Parameter |
Specification |
Process category |
|---|---|---|
|
Circuit structures |
Single-sided, double-sided, multilayer, flexible, rigid-flex |
Construction |
|
Electrical layer count |
1–68 copper layers |
Construction |
|
Common stackup configurations |
4, 6, 8, 10, 12, 14, 16, 18 layers |
Construction |
|
HDI interconnects |
Microvias, blind vias, buried vias; HDI build-up to 9 + N + 9 |
Construction |
|
Via-in-pad / VIPPO |
Filled and plated-over structures |
Construction |
|
Controlled impedance |
±5% impedance tolerance |
Construction |
|
Laminate families |
FR-4, High-Tg, Rogers, Arlon, polyimide, aluminum |
Materials |
|
FR-4 laminate options |
Shengyi Tg140/150/170; Kingboard Tg130/150/170; GOWORLD Tg130 |
Materials |
|
Additional laminates |
Isola IS410 / IS420; TUC TU-768 / TU-872; KB-6160 / KB-6167 |
Materials |
|
RF laminate |
Rogers RO4000 series |
Materials |
|
Other board materials |
CEM-3, CEM-1, FR-1, 22F, aluminum base, thermally conductive copper base |
Materials |
|
Outer copper weight |
1/7–12 oz |
Copper & plating |
|
Inner copper weight |
1/7–12 oz |
Copper & plating |
|
Circuit production |
Negative film; pattern plating |
Copper & plating |
|
Plated-hole copper thickness |
18–100 μm |
Copper & plating |
|
Metal edge-plating copper |
≥15 μm |
Copper & plating |
|
Minimum mechanical hole |
0.15 mm |
Drilling & vias |
|
Hole tolerance |
±0.025 mm |
Drilling & vias |
|
Press-fit hole tolerance |
±0.05 mm |
Drilling & vias |
|
Minimum annular-ring |
0.15 mm / 6 mil |
Drilling & vias |
|
Minimum via pad |
Mechanical: 0.30 mm; laser: 0.20 mm |
Drilling & vias |
|
Countersink diameter |
<6.5 mm |
Drilling & vias |
|
Countersink angles |
90°, 140°, 180° |
Drilling & vias |
|
Countersink tolerances |
Diameter ±0.1 mm; depth ±0.15 mm |
Drilling & vias |
|
Minimum plated half-hole |
0.6 mm |
Drilling & vias |
|
Ink plugging |
Solder-mask ink |
Drilling & vias |
|
Ink plugging: coverage |
Solder mask on both sides of the via |
Drilling & vias |
|
Ink plugging: diameter |
≤0.5 mm |
Drilling & vias |
|
Ink plugging: nearby openings |
Edge distance ≤0.2 mm is unsuitable |
Drilling & vias |
|
Solder-mask process |
LPI |
Mask & finish |
|
Solder-mask thickness |
≥10 μm |
Mask & finish |
|
Minimum solder-mask bridge |
60 µm |
Mask & finish |
|
Solder-mask colors |
Green, red, yellow, blue, white, black |
Mask & finish |
|
Surface finishes |
Leaded HASL, lead-free HASL, ENIG, OSP |
Mask & finish |
|
Legend line width |
0.15 mm |
Mask & finish |
|
Legend character height |
0.8 mm |
Mask & finish |
|
Legend colors |
Green, blue, black, white, red, yellow |
Mask & finish |
|
Maximum processing dimensions |
Width: 900 mm; length: 2100 mm |
Dimensions & panelization |
|
Minimum processing dimensions |
Width: 3 mm; length: 3 mm |
Dimensions & panelization |
|
Minimum panel size |
50 × 50 mm |
Dimensions & panelization |
|
Rigid PCB thickness |
0.1–14 mm |
Dimensions & panelization |
|
Thickness tolerance: T ≥1.0 mm |
±10% |
Dimensions & panelization |
|
Thickness tolerance: T <1.0 mm |
±0.1 mm |
Dimensions & panelization |
|
Process-edge |
≥3 mm |
Dimensions & panelization |
|
V-cut copper clearance |
≥0.4 mm |
Dimensions & panelization |
|
V-cut panel spacing |
0 mm |
Dimensions & panelization |
|
Routed edge to conductor |
≥0.3 mm |
Dimensions & panelization |
|
Outline tolerance |
±0.08 mm |
Dimensions & panelization |
|
Routed panel spacing |
1.6 or 2 mm by default |
Dimensions & panelization |
|
Routing process rail |
≥4 mm |
Dimensions & panelization |
|
SMT panels |
Rail 5 mm; fiducial 1 mm; tooling hole 2 mm |
Dimensions & panelization |
|
Inspection processes |
AOI, flying probe, electrical test, final inspection |
Inspection |
|
warpage |
0.75% |
Inspection |
|
Maximum flexible PCB layers |
20 |
Construction |
|
Maximum rigid-flex PCB layers |
24 |
Construction |
|
Minimum trace / space |
50 / 50 µm |
Construction |
|
Minimum laser hole |
0.10 mm |
Drilling & vias |
|
Maximum hole aspect ratio |
18:1 |
Drilling & vias |
|
Flexible PCB thickness |
0.06–1.0 mm |
Dimensions & panelization |
05 / Inspection & acceptance
Manufacturing capability.
Verified against the order.
Define the applicable standard, acceptance class, test coverage and required documentation as part of the manufacturing specification.
06 / Applied engineering
Process knowledge.
Applied to manufacturing cost.
We reduced a customer’s PCB manufacturing cost by optimizing panel layout, changing via treatment from open to plugged, and reducing the gold-plating area.
Improve material utilization.
We optimized the panel layout to increase laminate utilization.
Optimize via treatment.
We changed the relevant vias from open to plugged.
Reduce gold-plating area.
We reduced the gold-plating area to lower manufacturing cost.
Review your manufacturing specification.
Send Gerber and drill data, stackup, fabrication notes, quantity and your critical requirements. The team can review the construction, process and inspection scope.
Request a PCB Manufacturing Review
Send your manufacturing files and the requirements that matter most. Our team can review the construction, process options and inspection scope.
- Gerber and drill files
- Fabrication drawing and stackup
- Quantity and target delivery date
- Material, finish, impedance and inspection requirements
